Samsung Electronics said March 14 that it has begun mass producing the world’s highest-capacity mobile DRAM chip tailored for premium mobile devices, such as foldable smartphones.
The company’s new 12 gigabyte DRAM chip has 1.5 times higher capacity than the mainstream 8GB chip for ultra-thin laptops in the market. It packs six 16 gigabit DRAM chips inside, built based on the company’s mid-10-nanometer chip fabrication technology.
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Higher chip capacity for mobile devices is becoming necessary with the increasing adoption of new technologies in smartphones, including artificial intelligence, larger and higher resolution displays, multiple camera modules as well as 5G network services.
The 12GB DRAM chip will first be installed in Samsung’s foldable smartphone Galaxy Fold, which will likely hit the market as early as April. The chip will likely be supplied to other smartphone makers down the road, but Samsung did not reveal its potential partners for the new product.
The new memory chip’s data transfer speed clocks at 34.1 GB per second. Its compact size, at just 1.1 millimeter thick, helps allows mobile devices be thinner and lighter, according to the tech firm.
“With mass production of the new 12GB memory chip, Samsung is now providing a comprehensive lineup of advanced memory to power the new era of smartphones, from 12GB mobile DRAM to 512GB eUFS 3.0 storage,” said Chun Se-won, an executive vice president at Samsung Electronics.
“We’re strengthening our position as the premium mobile memory maker best positioned to accommodate rapidly growing demand from global smartphone manufacturers.”
By Kim Young-won (firstname.lastname@example.org)