Samsung Electronics is expected to adopt a stacked logic board, called a substrate-like PCB mainboard, in order to maximize the use of internal space for the upcoming Galaxy S9 next year, industry sources told ET News on Aug. 6.
This is the first time for the Korean tech giant to adopt the advanced logic board based on chip packaging technology. Its archrival Apple is also widely rumored to have used the upgraded mainboard technology for the iPhone 8 that will debut later this year.
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The substrate-like PCB is an advanced version of the current HDI circuit board. The stacked design, among other things, drastically improves space efficiency for battery whose size is getting bigger and bigger to high-end phones.
About 10 manufacturers are supplying HDI to Samsung currently, sources said. Of them, only four are reportedly joining the production of the substrate-like PCB that requires higher manufacturing know-how.
Samsung is expected to use the upgraded mainboard for S9 phones that use its own Exynos chips, while the phones using Qualcomm chips are not using the board due to technical differences.
By Yoon Kun-il (email@example.com) (firstname.lastname@example.org)
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